A CARRIER MEMBER FOR MANUFACTURING A SUBSTRATE AND A METHOD OF MANUFACTURING A SUBSTRATE USING THE SAME
PURPOSE: A carrier member for manufacturing a substrate and substrate manufacturing method using the same are provided to inject a gas into a hole to separate a buildup layer from the carrier member, thereby eliminating a routing process. CONSTITUTION: An insulating material(110) is laminated on one...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | PURPOSE: A carrier member for manufacturing a substrate and substrate manufacturing method using the same are provided to inject a gas into a hole to separate a buildup layer from the carrier member, thereby eliminating a routing process. CONSTITUTION: An insulating material(110) is laminated on one side or both sides of a base substrate(100). A releasing layer(120) whose size is smaller than the insulating material is arranged on one side of the insulating material. A metal layer(130) is arranged on one side of the releasing layer. A carrier member for manufacturing a substrate is provided by attaching the girth of the metal layer by the insulating material. A hole(150) penetrates a buildup layer and the carrier member after the buildup layer is formed on one side of the metal layer. The metal layer is separated from the releasing layer by injecting a gas into the hole. |
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