PRINTED CIRCUIT BOARD FOR SEMI-CONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A printed circuit board for a semiconductor package and a manufacturing method thereof are provided to lower the entire thermal expansion coefficient of a printed circuit board for a semiconductor package. CONSTITUTION: A buildup layer(110) forms a circuit pattern(115) including a via(113)....

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Bibliographische Detailangaben
Hauptverfasser:	SOHN, KEUNG JIN, CHANG, TAE EUN, PARK, JUNG HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A printed circuit board for a semiconductor package and a manufacturing method thereof are provided to lower the entire thermal expansion coefficient of a printed circuit board for a semiconductor package. CONSTITUTION: A buildup layer(110) forms a circuit pattern(115) including a via(113). A buffer layer(120) is placed on one side of the buildup layer and buries a metal bump(125) connected to the via. A semiconductor chip(130) is mounted on one side of the buffer layer and is connected to the metal bump.