FEEDING DEVICE OF LEAD FRAME FOR LIGHT-EMITTING DIODE DIE BONDER

PURPOSE: A lead frame feeding device of an LED die bonder is provided to prevent a lead frame from being twisted by installing two pilot pins on the right and left sides of a pushing plate for epoxy and bonding. CONSTITUTION: A front rail(11) is installed on the upper side of a main base(10). A base...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LEE, SUNG HEE, CHO, JUNG HYUN, JUNG, SUNG MIN, PARK, SANG IL, AHN, YONG SOO, HWANG, TAE SANG, KANG, CHUNG HWAN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A lead frame feeding device of an LED die bonder is provided to prevent a lead frame from being twisted by installing two pilot pins on the right and left sides of a pushing plate for epoxy and bonding. CONSTITUTION: A front rail(11) is installed on the upper side of a main base(10). A base(20) has a rear rail in parallel to the front rail. A first LM guide(31,32) is formed between the main base and the base and guides the base. A linear transfer unit includes a linear motor unit and a moving support plate(51) moved by the linear motor unit. A clamp unit clamps a lead frame(500) to transfer the lead frame along the longitudinal direction of the front rail and the rear rail.