IMPROVED METHOD FOR ENCAPSULATING THE EDGE OF A FLEXIBLE SHEET

The present invention is premised upon an inventive method of producing an over-molded edge portion on a flexible substrate, wherein the edge portion is void of open areas due to support devices in the mold cavity.

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Bibliographische Detailangaben
Hauptverfasser:	KEENIHAN JAMES R, CLAREY TODD M
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present invention is premised upon an inventive method of producing an over-molded edge portion on a flexible substrate, wherein the edge portion is void of open areas due to support devices in the mold cavity.