METHOD OF FORMING A HEATSINK
The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.
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| creator | MCDONALD DAVID L SLATON DAVID S |
| description | The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane. |
| format | Patent |
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| language | eng ; kor |
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| subjects | BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | METHOD OF FORMING A HEATSINK |
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