METHOD OF FORMING A HEATSINK

The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MCDONALD DAVID L, SLATON DAVID S
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure is related to methods for bonding TPG elements to at least a first metal material for forming a heatsink. The heatsinks have an improved thermal conductivity in the X-Y plane.