SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY

Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.

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Bibliographische Detailangaben
Hauptverfasser:	ROBINSON MARC E, ANDREWS LAWRENCE DOUGLAS JR, MC ELREA SIMON J.S
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	Stacked die assemblies are electrically connected to connection sites on any support, without electrical connection to any interposed substrate or leadframe, and without solder.