UNIVERSAL INTER-LAYER INTERCONNECT FOR MULTI-LAYER SEMICONDUCTOR STACKS

UNIVERSAL INTER-LAYER INTERCONNECT FOR MULTI-LAYER SEMICONDUCTOR STACKS

PURPOSE: An interlayer interconnection for a multilayer semiconductor stack is provided to easily perform a communication between functional units using a universal and standardized interlayer bus. CONSTITUTION: Contact pads(22) are arranged on the surface of a semiconductor die(12). A gray pad(24)...

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Bibliographische Detailangaben
Hauptverfasser: VANDERWIEL STEVEN PAUL, JOHNSON CHARLES LUTHER, VAREKAMP PATRICK RONALD, HOOVER RUSSELL DEAN, BARTLEY GERALD K
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: An interlayer interconnection for a multilayer semiconductor stack is provided to easily perform a communication between functional units using a universal and standardized interlayer bus. CONSTITUTION: Contact pads(22) are arranged on the surface of a semiconductor die(12). A gray pad(24) is interposed in an interlayer interface region(18). The gray pad is combined with a conductor for an interlayer bus. A black pad(26) is combined with a positive voltage or a ground. A white pad is electrically separated from an active circuit.