APPARATUS AND METHOD FOR PRE-BONDING OF THE DRIVE INTEGRATED CIRCUIT
PURPOSE: A device and a method for pre-bonding a drive IC(Integrated Circuit) are provided to align a drive IC after checking a location of the drive IC, thereby preventing error about a state of the liquid crystal display panel. CONSTITUTION: A conveyor(11) transfers an LCD(Liquid Crystal Display)...
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Format: | Patent |
Sprache: | eng ; kor |
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Zusammenfassung: | PURPOSE: A device and a method for pre-bonding a drive IC(Integrated Circuit) are provided to align a drive IC after checking a location of the drive IC, thereby preventing error about a state of the liquid crystal display panel. CONSTITUTION: A conveyor(11) transfers an LCD(Liquid Crystal Display) panel to a stage(10) in the first direction. A mount head(20) pre-bonds a drive IC of the liquid crystal display panel. A transfer unit(30) transfers the mount head. A camera unit(50) recognizes a location by photographing the drive IC and the LCD panel. The mount head moves between the photographing location and the pre-bonded position. |
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