METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

PURPOSE: A method for manufacturing a semiconductor package is provided to easily obtain marked information through a scanner by making information stored in an integrated production control system on the surface of a semiconductor package in a barcode type. CONSTITUTION: A printed circuit board is...

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Bibliographische Detailangaben
Hauptverfasser:	HYEON, JEONG HO, CHO, HUN IL, CHO, GI SIK, KIM, YONG MIN, YEO, DONG HEE, BEACK, HYUN SU
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing a semiconductor package is provided to easily obtain marked information through a scanner by making information stored in an integrated production control system on the surface of a semiconductor package in a barcode type. CONSTITUTION: A printed circuit board is prepared(S110). Basic information for indentifying a semiconductor package is marked on a tag(S120). The basic information is stored in a storage medium(S130). The mounting process history of a semiconductor chip is stored in the storage medium(S140). The packaging process history of a semiconductor package is stored in the storage medium(S150). The information stored in the storage medium is marked on the semiconductor package in a barcode type(S160).