STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING PRINTED WIRING BOARDS, AND ADHESIVE HAVING ANISOTROPIC CONDUCTIVITY

PURPOSE: A connection structure of a print circuit board, a method for connecting the printed circuit board, and an adhesive with anisotropic conductivity are provided to improve the reliability of an electrical connection between a first electrode and a second electrode by forming a cavity between...

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Bibliographische Detailangaben
Hauptverfasser: KARIYA AYAO, NAKATSUGI KYOUICHIROU, SATOU KATSUHIRO, OKUDA YASUHIRO, YAMAMOTO MASAMICHI
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:PURPOSE: A connection structure of a print circuit board, a method for connecting the printed circuit board, and an adhesive with anisotropic conductivity are provided to improve the reliability of an electrical connection between a first electrode and a second electrode by forming a cavity between the first and second electrodes. CONSTITUTION: A plurality of first electrodes(12,13) are formed on a first substrate(11). A plurality of second electrodes(22,23) are formed on a second substrate(21). An adhesive layer(30a) is formed between the first and second substrates and is comprised of the adhesive including conductive particles. A cavity is formed between the first and second electrodes. The pitch of the first electrode and the pitch of the second electrode are 10 um to 300 um.