STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING PRINTED WIRING BOARDS, AND ADHESIVE HAVING ANISOTROPIC CONDUCTIVITY
PURPOSE: A connection structure of a print circuit board, a method for connecting the printed circuit board, and an adhesive with anisotropic conductivity are provided to improve the reliability of an electrical connection between a first electrode and a second electrode by forming a cavity between...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng ; kor |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PURPOSE: A connection structure of a print circuit board, a method for connecting the printed circuit board, and an adhesive with anisotropic conductivity are provided to improve the reliability of an electrical connection between a first electrode and a second electrode by forming a cavity between the first and second electrodes. CONSTITUTION: A plurality of first electrodes(12,13) are formed on a first substrate(11). A plurality of second electrodes(22,23) are formed on a second substrate(21). An adhesive layer(30a) is formed between the first and second substrates and is comprised of the adhesive including conductive particles. A cavity is formed between the first and second electrodes. The pitch of the first electrode and the pitch of the second electrode are 10 um to 300 um. |
---|