MANUFACTURING METHOD OF SUBSTRATE FOR A SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE, SUBSTRATE FOR A SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE

PURPOSE: A method for manufacturing a substrate for a semiconductor device, the substrate for the semiconductor device using the same, and the semiconductor device are provided to improve adhesion between a wire bonding and a semiconductor device by planarizing the upper side of the metal layer for a semiconductor device and/or metal electrode layer for an electrode. CONSTITUTION: A resist layer(21) is formed on the surface of a substrate(10) with conductivity. A resist layer is exposed by using a glass mask(30) including a mask pattern(31) with an intermediate transmission region of which transmittance is higher than a shielding region and is lower than a transmitting region between the transmission region and the shielding region. The resist layer is developed and a resist pattern(22) including an incline part(25) is formed on the substrate. The exposed part of the substrate is plated by using the resist pattern and a metal layer(40) including the incline part is formed. The resist pattern is removed.