PLASMA ETCHING APPARATUS FOR ETCHING THE EDGE OF SUBSTRATE

PURPOSE: A plasma etching apparatus is provided to reduce a cost for installing facilities by regulating the etching rate of a wafer without the change of an etching machine. CONSTITUTION: A gas distribution plate(250) divides and supplies reactive gas and non-reactive gas. A substrate supporting st...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	KWON, GI HYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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