PRECONDITION RELIABILITY TESTING METHOD FOR 3-D SHAPE MEASURING PACKAGE REFLOWED BY HOT AIR CONVECTION

PURPOSE: A method for evaluating the reliability is provided to measure a delamination phenomenon of the package generated in a reflow process in real time by using a three dimensional shape measurement method applying a moire pattern. CONSTITUTION: A temperature cycling test is performed to apply a...

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Bibliographische Detailangaben
Hauptverfasser: MOON, HO JEONG, OH, HYE KYONG
Format: Patent
Sprache:eng ; kor
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Zusammenfassung:PURPOSE: A method for evaluating the reliability is provided to measure a delamination phenomenon of the package generated in a reflow process in real time by using a three dimensional shape measurement method applying a moire pattern. CONSTITUTION: A temperature cycling test is performed to apply a thermal impact to a package. A baking test is performed to dry the package. A moisture soaking test is performed to humidify the dried package. A reflow test is performed to heat the humidified package with a hot air convection method. The delamination phenomenon of the reflowed package is measured as a three dimensional image.