ULTRA THIN TYPE LCD BACK LIGHT UNIT FOR SIDE VIEW AND METHOD FOR MANUFACTURING THE SAME

ULTRA THIN TYPE LCD BACK LIGHT UNIT FOR SIDE VIEW AND METHOD FOR MANUFACTURING THE SAME

PURPOSE: An ultra thin LCD back light unit for side view and a manufacturing method thereof are provided to integratedly mount an LED chip to a chip state without a package frame in one side part of a light guide plate. CONSTITUTION: An installation unit(100) is formed into a plate shape. In at leas...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, SANG MOOK, KIM, KANG HO, BAEK, JONG HYEOB, JEONG, TAK, YOM, HONG SEO, YU, YOUNG MOON, LEE, SANG HERN, JHIN, JUNG GUN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FREQUENCY-CHANGING
NON-LINEAR OPTICS
OPTICAL ANALOGUE/DIGITAL CONVERTERS
OPTICAL LOGIC ELEMENTS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:PURPOSE: An ultra thin LCD back light unit for side view and a manufacturing method thereof are provided to integratedly mount an LED chip to a chip state without a package frame in one side part of a light guide plate. CONSTITUTION: An installation unit(100) is formed into a plate shape. In at least one side part of the installation unit, one or plural installation spaces is formed. An LED package module is respectively arranged in the installation space. A power source is applied to the LED package module and the LED package module is light-emitted. The installation unit is one among the light guide plate of a diffusion plate. A reflection plate(300) is installed in the upper of the installation space.