MAGNETRON SPUTTERING APPARATUS

PURPOSE: A magnetron sputtering apparatus is provided to improve the uniformity of a thin film by circulating a magnet assembly on the surface parallel to a target. CONSTITUTION: A magnetron sputtering apparatus comprises multiple chambers(110,210) and one or more magnet assemblies(320). The multipl...

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Bibliographische Detailangaben
Hauptverfasser:	HWANG, SANG SOO, MA, HEE JEON, HA, JOO IL, GIM, DONG GEON
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PURPOSE: A magnetron sputtering apparatus is provided to improve the uniformity of a thin film by circulating a magnet assembly on the surface parallel to a target. CONSTITUTION: A magnetron sputtering apparatus comprises multiple chambers(110,210) and one or more magnet assemblies(320). The multiple chambers are adjacent to each other. Substrates(114,214) and targets(112,212) are formed inside the chamber. The chamber sputters the substrate using plasma. One or more magnet assemblies are disposed between multiple chambers.