CHEMICAL MECHANICAL POLISHING DEVICE

PURPOSE: A chemical mechanical polishing device is provided to maintain the uniform flatness of a wafer by controlling the speed of the rotation and minimizing the difference of polishing rate. CONSTITUTION: A chemical mechanical polishing device comprises a platen, a rotating unit, and a wafer head...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	PARK, SUNG HOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: A chemical mechanical polishing device is provided to maintain the uniform flatness of a wafer by controlling the speed of the rotation and minimizing the difference of polishing rate. CONSTITUTION: A chemical mechanical polishing device comprises a platen, a rotating unit, and a wafer head. The platen has polishing pads(111,121). The rotating unit rotates the platen. The wafer head applies pressure on the wafer and the polishing pad for rotation. The platen comprises inner and outer platens(110,120). The inner platen polishes the central part of the wafer. The outer platen is installed on the outer circumference of the inner platen and polishes the edge of the wafer.