DIE BONDER AND DIE BONDING METHOD USING THE SAME

DIE BONDER AND DIE BONDING METHOD USING THE SAME

PURPOSE: A die bonder and a die bonding method using the same are provided to reduce the time required to perform die bonding work by immediately separating and a eliminating a film from a wafer. CONSTITUTION: A fixing unit(100) adsorbs and fixes a wafer. A film eliminating unit(300) eliminates film...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: PARK, JOON SEOUN
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A die bonder and a die bonding method using the same are provided to reduce the time required to perform die bonding work by immediately separating and a eliminating a film from a wafer. CONSTITUTION: A fixing unit(100) adsorbs and fixes a wafer. A film eliminating unit(300) eliminates film from the wafer. A substrate supplier(400) supplies a substrate. An adhesive coating unit(500) coats an adhesive on a die or the substrate. A bonding unit(600) bonds the die on a fixed location of the substrate.