MULTI-LAYER PRINTED CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

MULTI-LAYER PRINTED CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

PURPOSE: A multi-layer printed circuit substrate and manufacturing a method thereof are provided to reduce an operation time by forming a via hole so that it is penetrated in a laminate. CONSTITUTION: In a multi-layer printed circuit substrate and manufacturing a method thereof, a laminate(10) is fo...

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1. Verfasser: CHO, KYU BEOM
Format: Patent
Sprache:eng ; kor
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator CHO, KYU BEOM
description PURPOSE: A multi-layer printed circuit substrate and manufacturing a method thereof are provided to reduce an operation time by forming a via hole so that it is penetrated in a laminate. CONSTITUTION: In a multi-layer printed circuit substrate and manufacturing a method thereof, a laminate(10) is formed by laminating a plurality of substrates. The laminate comprises an internal electrode. A surface electrode is formed on the surface of the laminate. At least more than one via holes(20) passes through the laminate. The via hole electrically interlinks the internal electrode and surface electrode.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MULTI-LAYER PRINTED CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
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