MULTI-LAYER PRINTED CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

PURPOSE: A multi-layer printed circuit substrate and manufacturing a method thereof are provided to reduce an operation time by forming a via hole so that it is penetrated in a laminate. CONSTITUTION: In a multi-layer printed circuit substrate and manufacturing a method thereof, a laminate(10) is fo...

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Bibliographische Detailangaben
1. Verfasser:	CHO, KYU BEOM
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A multi-layer printed circuit substrate and manufacturing a method thereof are provided to reduce an operation time by forming a via hole so that it is penetrated in a laminate. CONSTITUTION: In a multi-layer printed circuit substrate and manufacturing a method thereof, a laminate(10) is formed by laminating a plurality of substrates. The laminate comprises an internal electrode. A surface electrode is formed on the surface of the laminate. At least more than one via holes(20) passes through the laminate. The via hole electrically interlinks the internal electrode and surface electrode.