DISPLAY DEVICE AND METHOD FOR FABRICATING THE SAME

PURPOSE: A display device and a manufacturing method thereof are provided to absorb a bonding pressure delivered to a sub-connection electrode by alternatively laminating a plurality of hard layers and a soft layer on a spacer upper part. CONSTITUTION: A first substrate(105) and a second substrate(1...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SEO, CHANG KI, KANG, KYONG MIN, JUNG, YOUNG HYO, YU, HONG WOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A display device and a manufacturing method thereof are provided to absorb a bonding pressure delivered to a sub-connection electrode by alternatively laminating a plurality of hard layers and a soft layer on a spacer upper part. CONSTITUTION: A first substrate(105) and a second substrate(110) is bonded with facing each other. A driving means is formed on the first substrate. A connecting electrode(170) is connected to the driving means. A display means is formed on a pixel region of the second substrate. A spacer(150) is formed on the pixel region of the second substrate. A sub-connection electrode(174) is formed on the spacer for electrically connecting the display means with the connecting electrode. A buffer layer(172) is formed between the spacer and the sub-connection electrode. The buffer layer is composed of a hard layer and a soft layer.