MULTI-LAYER PRINTED CIRCUIT BOARD WITH EMBEDDED INTEGRATED CIRCUIT CHIP

MULTI-LAYER PRINTED CIRCUIT BOARD WITH EMBEDDED INTEGRATED CIRCUIT CHIP

PURPOSE: A multi-layer printed circuit board is provided to reduce the thickness by jutting out an IC chip into the window of a second substrate. CONSTITUTION: A circuit pattern is formed in the upper side of a first substrate(120). An IC chip is adhered on the first substrate. The IC chip is electr...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: KWOUN, SUN JONG
Format: Patent
Sprache:eng ; kor
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:PURPOSE: A multi-layer printed circuit board is provided to reduce the thickness by jutting out an IC chip into the window of a second substrate. CONSTITUTION: A circuit pattern is formed in the upper side of a first substrate(120). An IC chip is adhered on the first substrate. The IC chip is electrically connected to a part of the circuit pattern. An adhesive film is adhered on the first substrate. A second substrate(140) is adhered on the adhesive film. A window is formed within the second substrate. An upper isolation film(151) is formed on the second substrate in order to cover the window. The IC chip is projected into the window. A lower isolation film(111) is formed in the lower-part of the first substrate.