METHOD FOR MANUFACTURING A RELEASE FILM USED TO MOLD A SEMICONDUCTOR WITH RESIN, AND RELEASE FILM MADE BY THE SAME

PURPOSE: A method for manufacturing a release film which is used for molding a semiconductor package into a resin and the release film which is made using the same are provided to form a proper index of illumination on the resin surface of a molded semiconductor package. CONSTITUTION: A method for m...

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Bibliographische Detailangaben
Hauptverfasser:	WOO, BYOUNG CHAN, JANG, SANG UNG, SONG, MIN SOO
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: A method for manufacturing a release film which is used for molding a semiconductor package into a resin and the release film which is made using the same are provided to form a proper index of illumination on the resin surface of a molded semiconductor package. CONSTITUTION: A method for manufacturing a release film which is used for molding a semiconductor package into a resin comprises the following steps: forming illumination on one side of a metal substrate; laminating a fluoride-based film and a resin film on a side in which the illumination of the metal base is formed; heating and compressing the laminated film using a roll compressing device; and obtaining the release film by separating the laminated film from the metal base.