ECHANT WITH LOW CONCENTRATION OF HYDROGEN PEROXIDE FOR LAYERS OF COPPER OR COPPER ALLOY

PURPOSE: An echant for copper or copper alloy layers is provided to ensure excellent safety and productivity because an etching rate is fast and sudden reaction with copper does not occur, and to secure low re-adsorption rate while having good profile property. CONSTITUTION: An echant for copper or...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	PARK, HYO JUN, JEON, HYUNG JIN, BAEK, JIN SU, CHEUN, IL KUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	ADHESIVES CHEMISTRY DYES MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: An echant for copper or copper alloy layers is provided to ensure excellent safety and productivity because an etching rate is fast and sudden reaction with copper does not occur, and to secure low re-adsorption rate while having good profile property. CONSTITUTION: An echant for copper or copper alloy layers comprises 3~15 weight% peroxide, 1~15% hydrogen peroxide(H2O2), 1~20 weight% carboxylic acid, sulfonic acid or their mixture, 0.01~1 weight% chelating agent, and the balance of water. The peroxide is selected from the group consisting of potassium persulphate(K2O8S2), sodium perchlorate(NaClO4), potassium perchlorate(KClO4), perchloric acid calcium(Ca(ClO4)2), potassium peroxide(K2O2), sodium peroxide(Na2O2), calcium peroxide(CaO2), ammonium persulfate((NH4) 2S2O8), sodium persulphate(Na2S2O8), perchloric acid(HClO4), potassium permanganate(KMnO4), sodium permanganate(NaMnO4), potassium dichromate(K2Cr2O7), sodium bichromate(Na2Cr2O7) or their mixture.