POLISHING PAD OF WAFER NOTCH PORTION

POLISHING PAD OF WAFER NOTCH PORTION

PURPOSE: A polishing pad of a wafer notch part is provided to omit a shaping process of a polishing pad using a mustachio removing tool by peeling off a mustache-shaped material from the polishing pad using a slotted part. CONSTITUTION: A polishing pad of a wafer notch part polishes a notch part(22)...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIMIZU TOSHIKUNI, ICHIKAWA SHINYA
Format: Patent
Sprache:eng ; kor
Schlagworte:
GRINDING
PERFORMING OPERATIONS
POLISHING
TOOLS FOR GRINDING, BUFFING, OR SHARPENING
TRANSPORTING
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Beschreibung
Zusammenfassung:PURPOSE: A polishing pad of a wafer notch part is provided to omit a shaping process of a polishing pad using a mustachio removing tool by peeling off a mustache-shaped material from the polishing pad using a slotted part. CONSTITUTION: A polishing pad of a wafer notch part polishes a notch part(22) formed on the external periphery parts of a wafer(2). The annular polishing pad is made of non-woven fabric. The grinding pad comprises an outer peripheral part and stables. The external periphery part is formed in the cross-sectional shape according with the outline of the notch part. The notch part is formed on both sides of the polishing pad around the external periphery part of the polishing pad.