CAMERA MODULE OF METHOD FOR MANUFACUTURING THE SAME

PURPOSE: A camera module is provided to perform casing process and bonding process of ground pad on a wafer substrate. CONSTITUTION: An image sensor module(140) comprises a substrate, image sensor, ground pad, and sealing member. The image sensor is loaded on the upper surface of the substrate. The...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	RYU, JIN MUN
Format:	Patent
Sprache:	eng
Schlagworte:	ACCESSORIES THEREFOR APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USINGWAVES OTHER THAN OPTICAL WAVES APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FORPROJECTING OR VIEWING THEM BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY PHOTOGRAPHY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: A camera module is provided to perform casing process and bonding process of ground pad on a wafer substrate. CONSTITUTION: An image sensor module(140) comprises a substrate, image sensor, ground pad, and sealing member. The image sensor is loaded on the upper surface of the substrate. The ground pad is placed at the lower surface of the substrate. The sealing member seals image sensor. The lens member(160) is laminated on the image sensor module. A conductive member(170) is electrically connected with the ground pad.