METHOD OF INTERCONNECTION BETWEEN BONDING PAD AND SUBSTRATE CONDUCTING LAYER AND MULTI-FUNCTIONAL PRINTED CIRCUIT BOARD MANUFACTURED THEREOF

PURPOSE: A method for manufacturing a chip embedded printed circuit board is provided to simplify a process by electrically connecting the conductive layer of the substrate with the bonding pad of a semiconductor die through a bump. CONSTITUTION: A bump(26) is formed on a surface of a bonding pad(25) and a semiconductor die(20). The semiconductor die is attached to the surface(10) with an adhesive film or adhesive. A first insulation layer is stacked on the substrate. The first insulation layer has a cavity for receiving the semiconductor die. The second insulation layer and a conductive layer(60) are successively stacked on the semiconductor die and the second insulation layer. A heterogeneous metal layer is formed on the conductive layer by sputtering or plating.