METAL-CLAD LAMINATE, AND METHOD FOR PRODUCTION OF METAL-CLAD LAMINATE

Disclosed is a method for producing a metal-clad laminate comprising a film and a metal layer composed of an under layer and an upper layer. The method comprises the steps of: (a) forming the under layer on at least a part of the surface of the film by plating; (b) forming the upper layer on a first...

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Bibliographische Detailangaben
Hauptverfasser:	ZAMA SATORU, OHGA KENICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	Disclosed is a method for producing a metal-clad laminate comprising a film and a metal layer composed of an under layer and an upper layer. The method comprises the steps of: (a) forming the under layer on at least a part of the surface of the film by plating; (b) forming the upper layer on a first laminate produced in the step (a) by plating; and (c) thermally treating a second laminate formed in the step (b), wherein the film is a thermoplastic polymer film having flexibility, the under layer is composed of a nickel alloy, the upper layer is composed of copper, the plated films formed by the steps (a) and (b) have compressive stress before the step (c) is carried out, and the metal-clad laminate is shrunk in the direction of the film plane in the step (c).