PRINTED CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

PURPOSE: A printed circuit board assembly and a manufacturing method thereof are provided to minimize contaminant by attaching an electronic component to a substrate or film with adhesive. CONSTITUTION: A first substrate assembly(101) includes a plurality of devices(113a-113c). A plurality of device...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, JEONG UNG, JANG, SE YOUNG, HEO, GYUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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