PRINTED CIRCUIT BOARD ASSEMBLY AND MANUFACTURING METHOD THEREOF

PURPOSE: A printed circuit board assembly and a manufacturing method thereof are provided to minimize contaminant by attaching an electronic component to a substrate or film with adhesive. CONSTITUTION: A first substrate assembly(101) includes a plurality of devices(113a-113c). A plurality of device...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, JEONG UNG, JANG, SE YOUNG, HEO, GYUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A printed circuit board assembly and a manufacturing method thereof are provided to minimize contaminant by attaching an electronic component to a substrate or film with adhesive. CONSTITUTION: A first substrate assembly(101) includes a plurality of devices(113a-113c). A plurality of devices are attached to a film(111). A via hole is formed on the film. A plating layer is formed on the via hole. A solder bump is formed on the plating layer. A second substrate assembly includes at least one film layer and a circuit pattern layer. The circuit pattern layer is formed on one side or both sides of the film layer. A plurality of devices are connected to the circuit pattern layer through the plating layer. The plating layer is connected to the circuit pattern layer by the solder bump.