SEMICONDUCTOR DEVICE

A semiconductor device in which the transfer rate can be enhanced between chips without causing any noise or crosstalk. Input/output circuits, i.e. input circuits (27, 37) and output circuits (26, 36), are arranged directly beneath every connection pads (21, 31) for connecting a storage device chip...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: MABUCHI YOSHIHIRO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor device in which the transfer rate can be enhanced between chips without causing any noise or crosstalk. Input/output circuits, i.e. input circuits (27, 37) and output circuits (26, 36), are arranged directly beneath every connection pads (21, 31) for connecting a storage device chip (20) and the chip in an ASIC (30). The circuits are arranged in array or lattice and the storage device chip (20) and the ASIC (30) are mounted to face each other on the both surfaces of the wiring chip.