COLLET FOR TRANSFERRING A SEMICONDUCTOR CHIP AND APPARATUS INCLUDING THE SAME

PURPOSE: A collet for transferring semiconductor chips and a semiconductor chip transferring apparatus with the same are provided to prevent stain from being generated on the surface of a product due to bending, damage, and non-absorption. CONSTITUTION: A semiconductor chip transferring apparatus wi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	CHO, WON JUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHAMBERS PROVIDED WITH MANIPULATION DEVICES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HAND TOOLS MANIPULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PORTABLE POWER-DRIVEN TOOLS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: A collet for transferring semiconductor chips and a semiconductor chip transferring apparatus with the same are provided to prevent stain from being generated on the surface of a product due to bending, damage, and non-absorption. CONSTITUTION: A semiconductor chip transferring apparatus with a collet comprises a collet, a porous adsorption plate(20), and adsorption plate holder(10). The porous adsorption plate is formed by sintering synthetic resin through contacting the upper side of the semiconductor chip to adsorb a chip. An adsorption hole is formed on the adsorption plate holder to generate adsorption force on the lower side of the porous adsorption plate due to the adsorption of air.