APPARATUS FOR TREATING SUBSTRATE HAVING SUBSTRATE SUPPORT FRAME

APPARATUS FOR TREATING SUBSTRATE HAVING SUBSTRATE SUPPORT FRAME

PURPOSE: A substrate processing device is provided to improve quality of a thin film on a substrate by uniformly transmitting the heat from a substrate receiving unit by increasing a contact area between the substrate and the substrate receiving unit. CONSTITUTION: A substrate processing device incl...

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Hauptverfasser: PARK, SUK JU, HWANG, SEONG RYONG
Format: Patent
Sprache:eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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HWANG, SEONG RYONG
description PURPOSE: A substrate processing device is provided to improve quality of a thin film on a substrate by uniformly transmitting the heat from a substrate receiving unit by increasing a contact area between the substrate and the substrate receiving unit. CONSTITUTION: A substrate processing device includes a chamber, a substrate receiving unit(120), a gas injection unit, and a substrate support frame(130). A chamber has an entrance of a transfer robot. The substrate receiving unit is positioned inside the chamber, and ascends and descends. The gas injection unit supplies the raw material to the chamber. The substrate support frame is arranged on the substrate receiving unit inside the support frame. The substrate support frame includes an opening(135), a frame(131), a protrusion(162), and a depressed part(164). The opening vertically penetrates corresponding to a central part of the substrate receiving unit. The frame surrounds the opening and corresponds to the outer part of the substrate receiving unit. The protrusions are positioned around the opening and are connected to the frame. The protrusions receive the substrate. The depressed part is positioned between the protrusions.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title APPARATUS FOR TREATING SUBSTRATE HAVING SUBSTRATE SUPPORT FRAME
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