APPARATUS FOR TREATING SUBSTRATE HAVING SUBSTRATE SUPPORT FRAME

PURPOSE: A substrate processing device is provided to improve quality of a thin film on a substrate by uniformly transmitting the heat from a substrate receiving unit by increasing a contact area between the substrate and the substrate receiving unit. CONSTITUTION: A substrate processing device incl...

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Bibliographische Detailangaben
Hauptverfasser:	PARK, SUK JU, HWANG, SEONG RYONG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION ORPROCESSING OF GOODS ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS SEMICONDUCTOR DEVICES TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINSTCLIMATE CHANGE
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Beschreibung
Zusammenfassung:	PURPOSE: A substrate processing device is provided to improve quality of a thin film on a substrate by uniformly transmitting the heat from a substrate receiving unit by increasing a contact area between the substrate and the substrate receiving unit. CONSTITUTION: A substrate processing device includes a chamber, a substrate receiving unit(120), a gas injection unit, and a substrate support frame(130). A chamber has an entrance of a transfer robot. The substrate receiving unit is positioned inside the chamber, and ascends and descends. The gas injection unit supplies the raw material to the chamber. The substrate support frame is arranged on the substrate receiving unit inside the support frame. The substrate support frame includes an opening(135), a frame(131), a protrusion(162), and a depressed part(164). The opening vertically penetrates corresponding to a central part of the substrate receiving unit. The frame surrounds the opening and corresponds to the outer part of the substrate receiving unit. The protrusions are positioned around the opening and are connected to the frame. The protrusions receive the substrate. The depressed part is positioned between the protrusions.