CONDUCTIVE WIRE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE CONDUCTIVE WIRE

PURPOSE: A conductive wire, a manufacturing method thereof, and a semiconductor package including the same are provided to prevent electric short between conductive wires by narrowly arranging the conductive wires even through the conductive wires are mutually contacted. CONSTITUTION: A conductive w...

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Bibliographische Detailangaben
1. Verfasser: HWANG, TAE SEON
Format: Patent
Sprache:eng
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Zusammenfassung:PURPOSE: A conductive wire, a manufacturing method thereof, and a semiconductor package including the same are provided to prevent electric short between conductive wires by narrowly arranging the conductive wires even through the conductive wires are mutually contacted. CONSTITUTION: A conductive wire unit(10) includes metal particles and has a line shape. An insulation layer(20) surrounds the conductive wire and is made of the polymer. A reactor layer(30) is interposed between the conductive wire unit and the insulation layer. The reactor layer has a reactor connecting the polymer with each metal particle.