EPOXY RESIN, PREPARING METHOD OF THE SAME AND ITS USAGE

PURPOSE: An epoxy resin is provided to ensure excellent adhesive force, to improve adhesion with a lead frame and moisture resistant reliability when used as a semiconductor sealing material and to reduce the generation of cracks. CONSTITUTION: An epoxy resin has a structure represented by the chemi...

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Hauptverfasser:	SUNG, ICK KYUNG, CHUNG, JUNG HA, SEONG, SANG YOUB, LEE, SANG MIN
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PURPOSE: An epoxy resin is provided to ensure excellent adhesive force, to improve adhesion with a lead frame and moisture resistant reliability when used as a semiconductor sealing material and to reduce the generation of cracks. CONSTITUTION: An epoxy resin has a structure represented by the chemical formula 1 and 500 or more of average molecular weight by GPC. A method for preparing the epoxy resin comprises a step for condensing a polyphenol compound represented by chemical formula 2 and epichlorohydrin. In chemical formula 1, R1, R2 and R3 are the same or different and represent hydrogen atom or C1-4 alkyl group; I and k are an integer of 0-3; j is an integer of 0-4; m represents an integer as a mean value.