PHOTORESIST COMPOSITION, DRY FILM RESIST, RELIEF PATTERN, PATTERNING METHOD AND ELECTRONIC PARTS

PURPOSE: A photoresist composition is provided to show excellent patterning performance, solvent resistance and chemical resistance, and to be used for an inkjet printer head. CONSTITUTION: A photoresist composition comprises an epoxidized polyfunctional bisphenol B novolac resin and at least one ph...

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Bibliographische Detailangaben
Hauptverfasser:	SUNG, ICK KYUNG, CHUNG, JUNG HA, SEONG, SANG YOUB, LEE, SANG MIN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	PURPOSE: A photoresist composition is provided to show excellent patterning performance, solvent resistance and chemical resistance, and to be used for an inkjet printer head. CONSTITUTION: A photoresist composition comprises an epoxidized polyfunctional bisphenol B novolac resin and at least one photoacid generator compound. A method for forming a relief comprises the steps of: applying the photoresist composition on a substrate; heating the coated substrate; irradiating actinic rays to the coated substrate through a mask; heating the irradiated region to crosslink it; developing an image to form a relief phase of a mask; and cross-linking the developed relief phase by heating.