CIRCUIT MODULE WITH IMPROVED JUNCTION INTENSITY

PURPOSE: A circuit module having an improved bonding intensity is provided to widen a contact area between a PCB and a side unit of a cover, thereby improving bonding intensity. CONSTITUTION: A conductive pad is formed on one side of a PCB(100). A cover(200) consists of an upper unit(210) and a side...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	YANG, TAE SEOK
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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