CIRCUIT MODULE WITH IMPROVED JUNCTION INTENSITY

PURPOSE: A circuit module having an improved bonding intensity is provided to widen a contact area between a PCB and a side unit of a cover, thereby improving bonding intensity. CONSTITUTION: A conductive pad is formed on one side of a PCB(100). A cover(200) consists of an upper unit(210) and a side...

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Bibliographische Detailangaben
1. Verfasser:	YANG, TAE SEOK
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A circuit module having an improved bonding intensity is provided to widen a contact area between a PCB and a side unit of a cover, thereby improving bonding intensity. CONSTITUTION: A conductive pad is formed on one side of a PCB(100). A cover(200) consists of an upper unit(210) and a side unit(220). The side unit is bent in the upper unit. The side unit has a contact unit. The contact unit is formed through bending of the side unit. A soldering unit fixes the contact unit and a conductive pad by soldering the contact unit and the conductive pad. A preset part of sections of the side unit is outwardly bent. The soldering unit is formed between the outwardly bent contact unit and the PCB.