LIGHT EMITTING DIODE PACKAGE

LIGHT EMITTING DIODE PACKAGE

PURPOSE: An LED package is provided to improve main properties of encapsulant at the same time by optimizing glass beads dispersed to the encapsulant. CONSTITUTION: An LED package(1) includes an LED chip(2), metal lead terminals(3a,3b), a housing(4), an encapsulant(5), and glass beads(6). The encaps...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: LEE, JAE HEUN, WOO, DO CHOUL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: An LED package is provided to improve main properties of encapsulant at the same time by optimizing glass beads dispersed to the encapsulant. CONSTITUTION: An LED package(1) includes an LED chip(2), metal lead terminals(3a,3b), a housing(4), an encapsulant(5), and glass beads(6). The encapsulant is made of a light transmitting resin material, and encapsulates the LED chip. The glass beads have a size less than 10um, and are dispersed inside the encapsulant. The metal lead terminals supply a power to the LED chip. The reflector type housing supports the metal lead terminals.