PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve deflection of a printed circuit board by controlling difference of a grain size between adjacent metal layers within a fixed level. CONSTITUTION: A printed circuit board includes a base substrate and a metal...

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1. Verfasser: JANG, SEON HEE
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator JANG, SEON HEE
description PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve deflection of a printed circuit board by controlling difference of a grain size between adjacent metal layers within a fixed level. CONSTITUTION: A printed circuit board includes a base substrate and a metal layer. The metal layer for the circuit is formed on the base substrate, and includes a first metal layer and a second metal layer. The first metal layer is formed on the base substrate. The second metal layer is formed on the first metal layer. Difference of an average size of a grain which forms the first metal layer and the second metal layer is less than 20%(S200).
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
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