PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve deflection of a printed circuit board by controlling difference of a grain size between adjacent metal layers within a fixed level. CONSTITUTION: A printed circuit board includes a base substrate and a metal...

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Bibliographische Detailangaben
1. Verfasser:	JANG, SEON HEE
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PURPOSE: A printed circuit board and a manufacturing method thereof are provided to improve deflection of a printed circuit board by controlling difference of a grain size between adjacent metal layers within a fixed level. CONSTITUTION: A printed circuit board includes a base substrate and a metal layer. The metal layer for the circuit is formed on the base substrate, and includes a first metal layer and a second metal layer. The first metal layer is formed on the base substrate. The second metal layer is formed on the first metal layer. Difference of an average size of a grain which forms the first metal layer and the second metal layer is less than 20%(S200).