APPARATUS AND METHOD FOR DEPOSITING A MATERIAL ON A LARGE-SIZE SUBSTRATE

PURPOSE: An apparatus and method for depositing a material on a large-size substrate is provided to supply temperature-controlled fluid in vertical direction to a substrate plane by placing a temperature-controlled fluid tube at the center of hollow inside a substrate holder. CONSTITUTION: In a devi...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, CHIN KYO, SOHN, YU RI, KIM, DOO SOO, KIM, YONG JIN, JEON, MI HEE, LEE, DONG KUN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY NANOTECHNOLOGY PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: An apparatus and method for depositing a material on a large-size substrate is provided to supply temperature-controlled fluid in vertical direction to a substrate plane by placing a temperature-controlled fluid tube at the center of hollow inside a substrate holder. CONSTITUTION: In a device, a deposition apparatus includes a reaction chamber(200) having an exhaust pipe(260), a first reaction gas supply pipe(210), a second reaction gas supply pipe(230), a substrate holder(340), and an electric furnace(270). An internal hollow(354) circulating temperature-controlled fluid is formed in the substrate holder. The fluid supply tube(351) is inserted into the central part of the hollow. One end part of the fluid supply tube is located to face to the substrate while being perpendiculars to the substrate. A diffusion unit(352) and a fluid guide(353) are formed at the end part of the substrate at the fluid supply pipe. The spreading unit is comprised of a mesh or the diffusing plate having a plurality of through-holes.