METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED CIRCUIT BOARD UNIT

PURPOSE: A printed wiring board manufacturing method and a printed board unit manufacturing method are provided to improve reliability of a printed wiring board by performing firm electric connection between a land on a build up layer and a land on a core board. CONSTITUTION: An adhesive sheet(51) o...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAGAWA TAKASHI, FUKUZONO KENJI, KANDA TAKASHI, YOSHIMURA HIDEAKI, YAGI TOMOHISA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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