METHOD OF MAKING PRINTED WIRING BOARD AND METHOD OF MAKING PRINTED CIRCUIT BOARD UNIT

PURPOSE: A printed wiring board manufacturing method and a printed board unit manufacturing method are provided to improve reliability of a printed wiring board by performing firm electric connection between a land on a build up layer and a land on a core board. CONSTITUTION: An adhesive sheet(51) of thermosetting resin is inserted between a first supporter(33) and a second supporter(28). Within an opening formed in the adhesive sheet, a second conductive land(41) on the second supporter is faced with a first conductive land(31) on the first supporter. A pillar(53b) is coupled with the first and second conductive lands. By pressing and heating the first supporter in a second supporter direction, the adhesive sheet is softened. By heating the adhesive sheet, melting of the pillar is induced. Matrix material(53a) is hardened after the melting of the pillar.