COMPLEX FILM FOR MANUFACTURING FPCB AND MANUFACTURING METHOD OF FPCB USING THE SAME

PURPOSE: A complex film for manufacturing an FPCB and a method for manufacturing FPCB using the same are provided to improve work environment by using a harmless product, and to improve productivity by reducing the number of operation processes. CONSTITUTION: A first mold-release layer(31) and a sec...

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Bibliographische Detailangaben
1. Verfasser:	JUN, ME KYUNG
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PURPOSE: A complex film for manufacturing an FPCB and a method for manufacturing FPCB using the same are provided to improve work environment by using a harmless product, and to improve productivity by reducing the number of operation processes. CONSTITUTION: A first mold-release layer(31) and a second mold-release layer(35) include High Isotactic Poly Propylene. A cushion layer(33) includes Polyamide, and is arranged between the first mold-release layer and the second mold-release layer. The first mold-release layer and the second mold-release layer are formed in one body. A melt index of HIPP is 0.5g/10min ~ 25g/10min(230°C). An isotactic index of the HIPP is 96% or greater. The cushion layer includes a nylon component of 50wt% or more.