SEMICONDUCTOR PACKAGE

PURPOSE: A semiconductor package is provided to discharge the heat from a semiconductor chip to the outside by attaching a hybrid heat discharging unit exposed to the outside through the molding compound resin to the semiconductor chip stacked in the uppermost area. CONSTITUTION: A chip stack package has a structure with a plurality of semiconductor chips which are stacked on a printed circuit board(10) and are sealed with a molding compound resin(24). A hybrid heat discharging unit(30) exposed to the outside through the molding compound resin on the semiconductor chip(18b) stacked in the uppermost area among the plurality of semiconductor chips. The hybrid heat discharging unit is comprised of a transparent film(22b) of an FOW(Film Over Wire) characteristic stacked on the semiconductor chip in the uppermost area and a thermal conductive paste material(32) exposed to the outside through the molding compound resin coated on the transparent film.