METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER AND METHOD OF SAWING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER AND METHOD OF SAWING THE SAME

PURPOSE: A manufacturing method of a semiconductor chip package, a semiconductor wafer, and a cutting method thereof are provided to prevent damage to a wafer due to a laser used in cutting an encapsulation layer by successively irradiating at least two kinds of lasers to a scribe lane. CONSTITUTION...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIM, PYOUNG WAN, LEE, TAEK HOON, KIM, NAM SEOG
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A manufacturing method of a semiconductor chip package, a semiconductor wafer, and a cutting method thereof are provided to prevent damage to a wafer due to a laser used in cutting an encapsulation layer by successively irradiating at least two kinds of lasers to a scribe lane. CONSTITUTION: A protection layer(150) is formed on a scribe lane(103) of a wafer(100) in which a plurality of semiconductor chips(101,102) is formed. An encapsulation layer(190) is formed on a top part of the protection layer and the semiconductor chips. The semiconductor chips are divided by successively irradiating at least two kinds of lasers to the scribe lane in which the protection layer is formed. The encapsulation layer formed on the top part of the protection layer is cut by irradiating a first laser to the scribe lane. The protection layer and the wafer are cut by irradiating a second laser having a wavelength lower than the first laser to the scribe lane.