IMPRINTING METHOD

PURPOSE: An imprinting method is provided to remove the residue by removing a part of the other surface of an insulation layer after forming an engraved pattern in an insulation layer. CONSTITUTION: An insulation layer is laminated on a carrier. The insulation layer is made of material including the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	LEE, SANG MOON, KWAK, JEONG BOK, RA, SENUG HYUN
Format:	Patent
Sprache:	eng ; kor
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PURPOSE: An imprinting method is provided to remove the residue by removing a part of the other surface of an insulation layer after forming an engraved pattern in an insulation layer. CONSTITUTION: An insulation layer is laminated on a carrier. The insulation layer is made of material including the thermosetting resin. A release layer is interposed between the other side of the insulation layer and the carrier. A stamp is laminated on the insulation layer to press the engraved pattern to one side of the insulation layer(S110). The carrier is removed from the insulation layer. A part of the other side of the insulation layer is removed to expose the engraved pattern of the stamp(S120). The insulation layer is laminated on the circuit board. The stamp is separated from the insulation layer(S130). The surface roughness of the carrier is lower than the surface roughness of the stamp.