WAFER TYPE TEMPERATURE DETECTING ELEMENT IN THE FURNACE

WAFER TYPE TEMPERATURE DETECTING ELEMENT IN THE FURNACE

PURPOSE: A wafer type temperature detecting element in the furnace is provided to improve the precision of measurement and prevent a gap between a wafer and the temperature measuring point. CONSTITUTION: The wafer type temperature detecting element in the furnace includes the thermocouple(120) for w...

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Bibliographische Detailangaben
Hauptverfasser: HONG, SANG KI, PARK, JEONG WON, PARK, JU HONG, PARK, BYOUNG GUN, LEE, GYU HONG, KIM, JUN HYEUNG
Format: Patent
Sprache:eng ; kor
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PURPOSE: A wafer type temperature detecting element in the furnace is provided to improve the precision of measurement and prevent a gap between a wafer and the temperature measuring point. CONSTITUTION: The wafer type temperature detecting element in the furnace includes the thermocouple(120) for wafer. The sample wafer(112) is coupled with the contact region of temperature measuring point site and a thermocouple by depositing platinum. The sample wafer is a wafer of same material as the wafer. The junction is performed by welding including a brazing and a laser beam welding. Therefore, the process efficiency and precision of measurement can be improved.